Category:Package
Common Package Gallery
TO-220 (PTH)
TO-252 (SMT)
SOT-89
Simiarity
- SOD323 - DO-219AC
Unsort
| Header text | Header text | Header text | |
|---|---|---|---|
| VSSOP-10 / MSOP-10 | ADS1115, CH340E | 3mm / 0.5mm | 引脚加宽 |
| VSSOP-8 | TXB0102 | Example | |
| TSSOP-14 | TXB0104 | Example | |
| TQFP-32 | Atmega328P | ||
| LQFP-48 | CH559 | 7*7 / 0.5 | |
| SOP-16 | CH340G | 3.9 / 1.27 | |
| SOP-8 | CH340N | 3.9 / 1.27 | |
| SSOP-20 | CH340T | 5.3 / 0.65 |
- SOT-23 (5) 2.90 mm x 1.60 mm
- SC-70 (5) 2.00 mm x 1.30 mm
- SOT-553 (5) 1.65 mm x 1.20 mm
Passive: Rectangular passive components (mostly resistors and capacitors)
SMD
| Header text | Metric | Metric | Power | |
|---|---|---|---|---|
| 0805 | 2012 | 2.0 mm × 1.25 mm | 0.079 in × 0.049 in | 0.125 watt |
| 1206 | 3216 | 3.2 mm × 1.6 mm | 0.13 in × 0.063 in | 0.25 watt |
| Example | Example | Example |
- 01005 (0402 metric): 0.4 mm × 0.2 mm (0.016 in × 0.0079 in). Typical power rating for resistors = 0.031 watt[8]
- 0201 (0603 metric): 0.6 mm × 0.3 mm (0.024 in × 0.012 in). Typical power rating for resistors = 0.05 watt[8]
- 0402 (1005 metric): 1.0 mm × 0.5 mm (0.039 in × 0.020 in). Typical power rating for resistors = 0.1 [8] or 0.062 watt[9]
- 0603 (1608 metric): 1.6 mm × 0.8 mm (0.063 in × 0.031 in). Typical power rating for resistors = 0.1 watt[8]
- 0805 (2012 metric): 2.0 mm × 1.25 mm (0.079 in × 0.049 in). Typical power rating for resistors = 0.125 watt[8]
- 1008 (2520 metric): 2.5 mm × 2.0 mm (0.098 in × 0.079 in). Typical inductor and ferrite bead package[10]
- 1206 (3216 metric): 3.2 mm × 1.6 mm (0.13 in × 0.063 in). Typical power rating for resistors = 0.25 watt[8]
- 1210 (3225 metric): 3.2 mm × 2.5 mm (0.13 in × 0.098 in). Typical power rating for resistors = 0.5 watt[8]
- 1806 (4516 metric): 4.5 mm × 1.6 mm (0.18 in × 0.063 in)[11]
- 1812 (4532 metric): 4.5 mm × 3.2 mm (0.18 in × 0.13 in). Typical power rating for resistors = 0.75 watt[8]
- 2010 (5025 metric): 5.0 mm × 2.5 mm (0.20 in × 0.098 in). Typical power rating for resistors = 0.75 watt[8]
- 2512 (6332 metric): 6.4 mm × 3.2 mm (0.25 in × 0.13 in). Typical power rating for resistors = 1 watt[8]
- 2920: 7.4 mm × 5.1 mm (0.29 in × 0.20 in)[12]
DIP
DIPresistance encapsulated as AXIAL-xx form (eg AXIAL-0.3, AXIAL-0.4), on behalf of the pad center spacing xx inches.
Common Package: AXIAL-0.3, AXIAL-0.4, AXIAL-0.5, AXIAL-0.6, AXIAL-0.7, AXIAL-0.8, AXIAL-0.9, AXIAL-1.0.
Three-terminal packages
- SOT: Small Outline Transistor, three terminals
- SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad
- SOT-89: 4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad
- SOT-23 (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor
- SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals
- SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals
- SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals
- SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead
- SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless
- DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
- D2PAK (TO-263, SOT-404): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
- D3PAK (TO-268): even larger than D2PAK
Five- and six-terminal packages
SOT: small-outline transistor, with more than three terminals
- SOT-23-5 (SOT-25): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals
- SOT-23-6 (SOT-26): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals
- SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals
- SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals
- SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals
- SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals
- SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
- SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
- SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
- SOT-886: 1 mm × 1.45 mm × 0.5 mm body: six terminals: leadless
- SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
- SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
- SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals
- SOT-1115: 0.9 mm × 1 mm × 0.35 mm body: six terminals: leadless
- SOT-1202: 1 mm × 1 mm × 0.35 mm body: six terminals: leadless
Packages with more than six terminals
Dual-in-line
- flatpack was one of the earliest surface-mounted packages.
- SOIC: (Small-Outline Integrated Circuit), dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
- SOJ: Small-Outline Package, J-Leaded, the same as SOIC except J-leaded [48]
- TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
- SSOP: Shrink Small-Outline Package, pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm
- TSSOP: Thin Shrink Small-Outline package.
- QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm,
- VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
- DFN: Dual Flat No-lead, smaller footprint than leaded equivalent
Quad-in-line
- PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
- QFP: Quad Flat Package, various sizes, with pins on all four sides
- LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
- PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
- CQFP: Ceramic Quad Flat-Pack, similar to PQFP
- MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
- TQFP: Thin Quad Flat Pack, a thinner version of PQFP
- QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
- LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
- MLP (MLF): Micro Leadframe Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN)
- PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking
Grid arrays
- PGA: Pin grid array.
- BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
- LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
- FBGA: Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
- LFBGA: Low profile Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
- TFBGA: Thin Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
- CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
- CCGA: Ceramic Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
- μBGA: micro-BGA, with ball spacing less than 1 mm
- LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
Non-packaged devices
(although surface-mount, these devices require specific process for assembly):
- COB: Chip-On-Board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
- COF: Chip-On-Flex; a variation of COB, where a chip is mounted directly to a flex circuit.
- COG: Chip-On-Glass; a variation of COB, where a chip, typically a Liquid crystal display (LCD) controller, is mounted directly on glass:.
Crystal
| Image | Description | Eagle Library |
|---|---|---|
 |
32.768 KHz (12.5pF) for timekeeping | crystal.libr:crystal:TC38H |
 |
5.0000 MHz in HC-49 package | crystal.libr:crystal:HC49 |
 |
3.579545 MHz ("colorburst") crystal | crystal.libr:crystal:HC49 |
Tantalum Capacitor
refer to page Tantalum capacitor
Note
Pitch
0.05 inch equals to 1.27 mm, SOP has 0.05 inch pitch and SSOP has 0.025 inch pitch, check in following images:
SOP28
SSOP 28
How to find package in Eagle
- Open the Board editor,
- Hit the Add button (or command)
- Search for *SOIC*
- It will show you all the SOIC packages. There should be one in ref-packages.
Auto generate symmetric SMD
All units in mm. Use eagle symmetric SMD package ULP to generate following footprint.
| Package | Type | Family | A (Length) | B (Width) | B1 (Body Width) | P (Pitch) |
|---|---|---|---|---|---|---|
| SO-P8 | Dual | SOP | 4.9 | 6 | 3.9 | 1.27 |
| SOP-16 | Dual | SOP | 9.9 | 6 | 3.9 | 1.27 |
| SOP-20 | Dual | SOP | 12.8 | 10.3 | 7.5 | 1.27 |
| SOP-28 | Dual | SOP | 17.9 | 10.325 | 7.5 | 1.27 |
| SSOP8 | Dual | SSOP | 2.9 | 6 | 3.9 | 0.64 |
| SSOP16 | Dual | SSOP | 4.9 | 6 | 3.9 | 0.64 |
| SSOP20 | Dual | SSOP | 8.65 | 6 | 3.9 | 0.64 |
| SSOP28 | Dual | SSOP | 9.9 | 6 | 3.9 | 0.64 |
| SSOP48 | Dual | SSOP | 16 | 10.4 | 7.6 | 0.635 |
| MSOP10 | Dual | MSOP | 3 | 4.9 | 3 | 0.5 |
| TSSOP10 | Dual | TSSOP | 3 | 6.4 | 4.4 | 0.65 |
| TSSOP14 | Dual | TSSOP | 5 | 6.4 | 4.4 | 0.65 |
| TSSOP20 | Dual | TSSOP | 6.5 | 6.4 | 4.4 | 0.65 |
| TQFP32 | Quad | TQFP | 7 | 7 | 5 | 0.5 |
| TQFP32-0.8P | Quad | TQFP | 9 | 9 | 7 | 0.8 |
| TQFP64-0.8P | Quad | TQFP | 16 | 16 | 14 | 0.8 |
| TQFP48 | Quad | TQFP | 9 | 9 | 7 | 0.5 |
| LQFP64 | Quad | LQFP | 12 | 12 | 10 | 0.5 |
| TQFP100 | Quad | TQFP | 16 | 16 | 14 | 0.5 |
Reference
- [http://en.wikipedia.org/wiki/Surface-mount_technology From wikipedia page here.
- Package dimension reference page
- Search by using NXP