Chao at 06:53, 10 February 2022

2022-02-10T06:53:32Z

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== Common Package Gallery ==
<gallery>
File:1794-00.jpg | TO-220 (PTH)
File:TO-252.jpg | TO-252 (SMT)
File:SOT-89.jpg | SOT-89

</gallery>

== Simiarity ==
* SOD323 - DO-219AC

== Unsort ==

{| class="wikitable sortable"
|-
! Header text !! Header text !! Header text
|-
| VSSOP-10 / MSOP-10 || ADS1115, CH340E || 3mm / 0.5mm || 引脚加宽
|-
| VSSOP-8 || TXB0102 || Example
|-
| TSSOP-14 || TXB0104 || Example
|-
| TQFP-32 || Atmega328P ||
|-
| LQFP-48 || CH559 || 7*7 / 0.5
|-
| SOP-16 || CH340G || 3.9 / 1.27
|-
| SOP-8 || CH340N || 3.9 / 1.27
|-
| SSOP-20 || CH340T || 5.3 / 0.65
|}

* SOT-23 (5) 2.90 mm x 1.60 mm
* SC-70 (5) 2.00 mm x 1.30 mm
* SOT-553 (5) 1.65 mm x 1.20 mm

== Passive: Rectangular passive components (mostly resistors and capacitors) ==
=== SMD ===
[[File:SMT sizes.png|thumbnail]]

{| class="wikitable sortable"
|-
! Header text !! Metric !! Metric !! !! Power
|-
| 0805 || 2012 || 2.0 mm × 1.25 mm || 0.079 in × 0.049 in || 0.125 watt
|-
| 1206 || 3216 || 3.2 mm × 1.6 mm || 0.13 in × 0.063 in || 0.25 watt
|-
| Example || Example || Example
|}

* 01005 (0402 metric): 0.4 mm × 0.2 mm (0.016 in × 0.0079 in). Typical power rating for resistors = 0.031 watt[8]
* 0201 (0603 metric): 0.6 mm × 0.3 mm (0.024 in × 0.012 in). Typical power rating for resistors = 0.05 watt[8]
* 0402 (1005 metric): 1.0 mm × 0.5 mm (0.039 in × 0.020 in). Typical power rating for resistors = 0.1 [8] or 0.062 watt[9]
* 0603 (1608 metric): 1.6 mm × 0.8 mm (0.063 in × 0.031 in). Typical power rating for resistors = 0.1 watt[8]
* 0805 (2012 metric): 2.0 mm × 1.25 mm (0.079 in × 0.049 in). Typical power rating for resistors = 0.125 watt[8]
* 1008 (2520 metric): 2.5 mm × 2.0 mm (0.098 in × 0.079 in). Typical inductor and ferrite bead package[10]
* 1206 (3216 metric): 3.2 mm × 1.6 mm (0.13 in × 0.063 in). Typical power rating for resistors = 0.25 watt[8]
* 1210 (3225 metric): 3.2 mm × 2.5 mm (0.13 in × 0.098 in). Typical power rating for resistors = 0.5 watt[8]
* 1806 (4516 metric): 4.5 mm × 1.6 mm (0.18 in × 0.063 in)[11]
* 1812 (4532 metric): 4.5 mm × 3.2 mm (0.18 in × 0.13 in). Typical power rating for resistors = 0.75 watt[8]
* 2010 (5025 metric): 5.0 mm × 2.5 mm (0.20 in × 0.098 in). Typical power rating for resistors = 0.75 watt[8]
* 2512 (6332 metric): 6.4 mm × 3.2 mm (0.25 in × 0.13 in). Typical power rating for resistors = 1 watt[8]
* 2920: 7.4 mm × 5.1 mm (0.29 in × 0.20 in)[12]

=== DIP ===
[[File:Resistor DIP.jpg|thumbnail]]
DIPresistance encapsulated as AXIAL-xx form (eg AXIAL-0.3, AXIAL-0.4), on behalf of the pad center spacing xx inches. <br />
Common Package: AXIAL-0.3, AXIAL-0.4, AXIAL-0.5, AXIAL-0.6, AXIAL-0.7, AXIAL-0.8, AXIAL-0.9, AXIAL-1.0.

== Three-terminal packages ==
[[File:SOT.jpg|thumbnail]]
* SOT: Small Outline Transistor, three terminals
:* '''SOT-223''': 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a '''large''' heat-transfer pad
:* '''SOT-89''': 4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad
:* '''SOT-23''' (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor
:* SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals
:* SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals
:* SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals
:* SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead
:* SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless
* DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
* D2PAK (TO-263, SOT-404): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
* D3PAK (TO-268): even larger than D2PAK

==Five- and six-terminal packages ==
SOT: small-outline transistor, with more than three terminals
* SOT-23-5 (SOT-25): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals
* SOT-23-6 (SOT-26): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals
* SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals
* SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals
* SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals
* SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals
* SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
* SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
* SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
* SOT-886: 1 mm × 1.45 mm × 0.5 mm body: six terminals: leadless
* SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
* SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
* SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals
* SOT-1115: 0.9 mm × 1 mm × 0.35 mm body: six terminals: leadless
* SOT-1202: 1 mm × 1 mm × 0.35 mm body: six terminals: leadless

=== Packages with more than six terminals ===
====Dual-in-line====
* flatpack was one of the earliest surface-mounted packages.
* SOIC: (Small-Outline Integrated Circuit), dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
* SOJ: Small-Outline Package, J-Leaded, the same as SOIC except J-leaded [48]
* TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
* SSOP: Shrink Small-Outline Package, pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm
* TSSOP: Thin Shrink Small-Outline package.
* QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm,
* VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
* DFN: Dual Flat No-lead, smaller footprint than leaded equivalent

====Quad-in-line====
* PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
* QFP: Quad Flat Package, various sizes, with pins on all four sides
* LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
* PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
* CQFP: Ceramic Quad Flat-Pack, similar to PQFP
* MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
* TQFP: Thin Quad Flat Pack, a thinner version of PQFP
* QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
* LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
* MLP (MLF): Micro Leadframe Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN)
* PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking
====Grid arrays====
* PGA: Pin grid array.
* BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
* LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
* FBGA: Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
* LFBGA: Low profile Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
* TFBGA: Thin Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
* CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
* CCGA: Ceramic Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
* μBGA: micro-BGA, with ball spacing less than 1 mm
* LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
====Non-packaged devices ====
(although surface-mount, these devices require specific process for assembly):
* COB: Chip-On-Board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
* COF: Chip-On-Flex; a variation of COB, where a chip is mounted directly to a flex circuit.
* COG: Chip-On-Glass; a variation of COB, where a chip, typically a Liquid crystal display (LCD) controller, is mounted directly on glass:.
== Crystal ==
{| class="wikitable sortable"
|-
! Image !! Description !! Eagle Library
|-
| [[File:Crystalcyl t.jpg|100]] || 32.768 KHz (12.5pF) for timekeeping || crystal.libr:crystal:TC38H
|-
| [[File:5mhzcrystal t.jpg|100px]] || 5.0000 MHz in HC-49 package || crystal.libr:crystal:HC49
|-
| [[File:Hc49u t.jpg|100px]] || 3.579545 MHz ("colorburst") crystal || crystal.libr:crystal:HC49
|}
== Tantalum Capacitor ==
refer to page [[Tantalum capacitor]]

== Note ==
=== Pitch ===
0.05 inch equals to 1.27 mm, SOP has 0.05 inch pitch and SSOP has 0.025 inch pitch, check in following images:<br />

<gallery>
File:Sop-8-Pitch.jpg|SOP28
File:Sop-28-Pitch.jpg|SSOP 28
</gallery>

=== How to find package in Eagle ===
# Open the Board editor,
# Hit the Add button (or command)
# Search for *SOIC*
# It will show you all the SOIC packages. There should be one in ref-packages.

== Auto generate symmetric SMD ==
All units in mm. Use eagle symmetric SMD package ULP to generate following footprint.
<gallery>
File:Symmetric SMD package.png
File:Symmetric_SMD_package_quad.png
</gallery>
{| class="wikitable sortable"
|-
! Package !! Type !! Family !! A (Length) !! B (Width) !! B1 (Body Width) !! P (Pitch)
|-
| SO-P8 || Dual || SOP || 4.9 || 6 || 3.9 || 1.27
|-
| SOP-16 || Dual || SOP || 9.9 || 6 || 3.9 || 1.27
|-
| SOP-20 || Dual || SOP || 12.8 || 10.3 || 7.5 || 1.27
|-
| SOP-28 || Dual || SOP || 17.9 || 10.325 || 7.5 || 1.27
|-
| SSOP8 || Dual || SSOP || 2.9 || 6 || 3.9 || 0.64
|-
| SSOP16 || Dual || SSOP || 4.9 || 6 || 3.9 || 0.64
|-
| SSOP20 || Dual || SSOP || 8.65 || 6 || 3.9 || 0.64
|-
| SSOP28 || Dual || SSOP || 9.9 || 6 || 3.9 || 0.64
|-
| SSOP48 || Dual || SSOP || 16 || 10.4 || 7.6 || 0.635
|-
| MSOP10 || Dual || MSOP || 3 || 4.9 || 3 || 0.5
|-
| TSSOP10 || Dual || TSSOP || 3 || 6.4 || 4.4 || 0.65
|-
| TSSOP14 || Dual || TSSOP || 5 || 6.4 || 4.4 || 0.65
|-
| TSSOP20 || Dual || TSSOP || 6.5 || 6.4 || 4.4 || 0.65
|-
| TQFP32 || Quad || TQFP || 7 || 7 || 5 || 0.5
|-
| TQFP32-0.8P || Quad || TQFP || 9 || 9 || 7 || 0.8
|-
| TQFP64-0.8P || Quad || TQFP || 16 || 16 || 14 || 0.8
|-
| TQFP48 || Quad || TQFP || 9 || 9 || 7 || 0.5
|-
| LQFP64 || Quad || LQFP || 12 || 12 || 10 || 0.5
|-
| TQFP100 || Quad || TQFP || 16 || 16 || 14 || 0.5
|}

== Reference ==
* [http://en.wikipedia.org/wiki/Surface-mount_technology From wikipedia page here.
* [http://www.meicer.com.tw/oldwebsite/ProductData/SSOP.htm Package dimension reference page]
* [http://www.nxp.com/packages/ Search by using NXP]

[[category: PCB]]

Category:Package - Revision history

Chao at 06:53, 10 February 2022