Solder Paste

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Revision as of 11:59, 21 October 2020 by Chao (talk | contribs) (Created page with "== Soldering Paste Combination == {| class="wikitable sortable" |- ! Combination !! Name !! Temp !! Type !! Feature |- | Sn99+Ag0.3+Cu0.7 || - || 217 || High |- | Sn63+Pb37||...")
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Soldering Paste Combination

Combination Name Temp Type Feature
Sn99+Ag0.3+Cu0.7 - 217 High
Sn63+Pb37 6337 183 Middle
Sn62.8+Pb36.8+Ag0.4 - 183 Middle
Sn42+Bi58 4258 138 Low Fragile

6337 - 240

Sn % Pb % Ag % Type Use Price Feature Melting Temp/Peak
63 37 - 3(25-45) for RCL, simple IC 0.5mm pitch 71 183/240
63 37 - 4(20-38) for RCL, dense IC 0.3-0.5mm pitch 76 183/240
63 37 - 5(15-30) for RCL, a lot dense IC 0.3mm pitch 80 183/240
62.9 36.9 0.2 4(20-38) for QFN type parts PCB 79 183/240
62.8 36.8 0.4 4(20-38) for BGA type parts PCB 84 more better conductibility 183/240
55 45 - 3(25-45) for LEDs, LED strip, etc 60 ?
60 40 - 3(25-45) better than above for LEDs, etc 68 ?

4258

Sn % Bi % -
42 58 -
Example Example Example